Solderless Breadboard

Order Code: 2223841.2

Category: General Lab Equipment I

Distribution strips are two Wire size is 21 to 26 AWG wire Tie points are two hundred Withstanding Voltage is 1,000V AC Tie points within IC are 630 Insulation Resistance is DC500V or 500M Dimension is 6.5*4.4*0.3 inch Rating is 5 Am...



SPECIFICATION

  • Distribution strips are two
  • Wire size is 21 to 26 AWG wire
  • Tie points are two hundred
  • Withstanding Voltage is 1,000V AC
  • Tie points within IC are 630
  • Insulation Resistance is DC500V or 500M
  • Dimension is 6.5*4.4*0.3 inch
  • Rating is 5 Amps
  • ABS plastic through color legend
  • ABS heat Distortion Temperature is 183° F (84°C)Hole or Pitch Style is 2.54mm

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