PART: EB1103-ND DESC: DESOLDER BRAID

Order Code: 21224811.1.54

Category: General Lab Equipment II

Features: Used in the rework and repair of printed circuit boards, computers, cell phones, or other electronics Easily removes solder from components or pads on a circuit board Concentrated fine copper braiding utilizes less length of wick ...



SPECIFICATION

Features:

  • Used in the rework and repair of printed circuit boards, computers, cell phones, or other electronics
  • Easily removes solder from components or pads on a circuit board
  • Concentrated fine copper braiding utilizes less length of wick for each desoldering application
  • Made of clean, oxide-free copper wire
  • Tight weave enables quick “on and off” desoldering
  • Formulated with a flux designed for higher activation temperatures
  • To be used in conjunction with processes using RMA type no-clean fluxes
  • 5’ and 10’ lengths available on static dissipative bobbins in compliance with ESD Association Standard
  • Leaves a residue that is environmentally safe
  • Uses flux classification type L0 per IPC J-STD-004B

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